Electronics Forum | Thu Dec 28 16:17:23 EST 2006 | joey_dragon
Good tidings, all. I am looking for a machine that will allow us to mount a flat flexible strip (such as TennRich's B.Type) to a row of pads on a PCB. I have not much knowledge about the process, I guess I expect to see a machine with some hot bar.
Electronics Forum | Thu Jan 04 20:31:21 EST 2007 | Ben_T
Have you thought about an AOI system? With the system we have where I work, I'm able to run queries that'll tell me DPMO, yield, and pass/fail rates on a board level, part level, and opportunity level. Furthermore, this data can be broken down to see
Electronics Forum | Mon Jan 29 10:11:12 EST 2007 | muse95
What does your customer want you to do? I would not want a CM soldering one of my boards with leadfree paste if I didn't ask him to. Whatever you do, get approval first. Two things to consider: If the other components are not rated for leadfree tem
Electronics Forum | Tue Jan 30 12:16:47 EST 2007 | pbarton
We are seeing unusual soldered joints when soldering to components with Pt/Ag metallised terminations. At the margin between the bottom of the component termination and the PCB surface there are a number of blowholes in the bulk solder. There also ap
Electronics Forum | Thu Feb 08 08:28:11 EST 2007 | mzaboogie
Good Morning Everyone, We have an application coming up with several BGA's on a RoHS assembly. One is a 25 mil ball on a 40 mil pitch, another is a 15 mil ball on a 40 mil pitch. In the past for leaded assemblies, we have used square apertures for 1
Electronics Forum | Thu Jul 19 04:38:33 EDT 2007 | chrispy1963
I took a Lead Free troubleshooting Class at SMTA in Chicago last September taught by Phil Zarrow. He told us during that seminar that its not a good practice to cross contaminate Leaded and Lead Free components but IF it is necesary than using lead
Electronics Forum | Fri Jul 20 08:16:38 EDT 2007 | chrispy1963
I agree that it would be crazy to think that every part a company manufactured had to be re-engineered to allow for higher temps. Out of the question and I NEVER implied that at all. What I said was that Zarrow told us that it was alright to use lea
Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef
Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to
Electronics Forum | Wed Oct 10 14:21:04 EDT 2007 | petep
We have done the Green Framed Stencils for an added $50.00 per, then got smart and went to green polyester on RoHS / Lead Free Stencils at no added cost. Dedicated Stencil blades and holders green of course) as well as Green Static mats on dedicated
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